Zalman ZM-STC9 heat sink compound 9.1 W/m·K 4 g

Manufacturer: Zalman

Model: ZM-STC9

EAN: 0823884209129

Zalman ZM-STC9 Heat Sink Compound is an efficient thermal paste compound that facilitates heat transfer between your CPU and cooler. This grey-colored compound boasts a thermal conductivity of 9.1 W/m·K, which means it can effectively dissipate heat from your CPU to the cooler. Its density of 2.7 g/cm³ ensures that it effectively fills in any gaps and air pockets between the surface of your CPU and the cooler. This thermal compound comes in a 4 ml volume syringe, which is easy to apply, and its viscosity of 250 Pa.s ensures that it can easily spread over the entire surface area of your CPU. The Zalman ZM-STC9 Heat Sink Compound also features blister packaging that keeps the compound fresh and ready to use whenever you need it. With a package weight of 28 grams and dimensions of 168 x 93 x 20 mm, this product is compact and easy to store. In addition to this, the Zalman ZM-STC9 Heat Sink Compound is RoHS certified, making it an environmentally friendly option for your computer's thermal management needs.