DELL Xeon Gold 5217 processor 3 GHz 11 MB
Manufacturer: DELL
Model: 338-BSDK
EAN: 5397184657690
DELL Xeon Gold 5217. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1024 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX-512, Scalability: 4S. Processor package size: 76.0 x 56.5 mm. Compatibility: - PowerEdge XR2 - PowerEdge R740xd2 - PowerEdge M640 VRTX - PowerEdge R640 - PowerEdge R740XD -...
List of offers from 2 merchants, starting at a price of €2582.22
| Shop | Title | Price |
|---|---|---|
www.pc21.fr |
DELL INTEL XEON GOLD 5217 | €2582.22 |
|
www.pure-gaming.fr |
DELL Xeon Gold 5217 processeur 3 GHz 11 Mo | €3261.90 |
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Product information
| Processor | |
| Processor manufacturer | Intel |
| Processor family | Intel® Xeon® Gold |
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor model | 5217 |
| Processor base frequency | 3 GHz |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Processor lithography | 14 nm |
| Box | |
| Cooler included | |
| Component for | Server/workstation |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Processor cache | 11 MB |
| Thermal Design Power (TDP) | 115 W |
| Processor codename | Cascade Lake |
| Processor ARK ID | 193396 |
| Graphics | |
| Discrete graphics card | |
| On-board graphics card | |
| On-board graphics card model | Not available |
| Discrete graphics card model | Not available |
| Processor special features | |
| Enhanced Intel SpeedStep Technology | |
| Intel® AES New Instructions (Intel® AES-NI) | |
| Intel® Speed Shift Technology | |
| Intel Trusted Execution Technology | |
| Intel® Hyper Threading Technology (Intel® HT Technology) | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Virtualization Technology for Directed I/O (VT-d) | |
| Intel 64 | |
| Intel Virtualization Technology (VT-x) | |
| Intel TSX-NI | |
| Intel Turbo Boost Max Technology 3.0 | |
| Intel® Volume Management Device (VMD) | |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | |
| Intel® Deep Learning Boost (Intel® DL Boost) | |
| Mode-based Execute Control (MBE) | |
| Intel® vPro™ Platform Eligibility | |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | |
| Intel® Run Sure Technology | |
| Intel® Resource Director Technology (Intel® RDT) | |
| Intel® Optane™ DC Persistent Memory Supported | |
| Intel VT-x with Extended Page Tables (EPT) | |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel Speed Select Technology (SST) | |
| Intel® Optane™ DC Persistent Memory technology | |
| Features | |
| Execute Disable Bit | |
| Market segment | Server |
| Maximum number of PCI Express lanes | 48 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Embedded options available | |
| PCI Express CEM revision | 3.0 |
| Scalability | 4S |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | |
| Technical details | |
| Product type | Processor |
| Launch date | Q2'19 |
| Memory speed (max) | 2667 MHz |
| Number of UPI links | 2 |
| Status | Launched |
| Operational conditions | |
| Tcase | 79 °C |
| Other features | |
| Compatibility | - PowerEdge XR2 - PowerEdge R740xd2 - PowerEdge M640 VRTX - PowerEdge R640 - PowerEdge R740XD - PowerEdge R540 - PowerEdge C6420 - PowerEdge R940 - PowerEdge R440 - PowerEdge M640 - PowerEdge R840 - PowerEdge R740 - PowerEdge T640 - PowerEdge MX740C - PowerEdge R940xa - PowerEdge MX840C - PowerEdge FC640 |
| Weight & dimensions | |
| Processor package size | 76.0 x 56.5 mm |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |