HP Intel Core i5-650 processor 3.2 GHz 4 MB L3

Manufacturer: HP

Model: 604614-001

EAN: 5711045476976

HP Intel Core i5-650. Processor family: Intel® Core™ i5, Processor socket: LGA 1156 (Socket H), Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card base frequency: 733 MHz. PCI Express configurations: 1x16, 2x8, Number of Processing Die Transistors: 382 M, Processing Die size: 81 mm². Intel® Virtualization Technology (Intel® VT): VT-x


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HP Intel Core i5-650 protsessor 3,2 GHz 4 MB L3 €488.00

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Product information

Processor
Processor family Intel® Core™ i5
Processor generation Intel® Core™ i5
Processor model i5-650
Processor base frequency 3.2 GHz
Processor cores 2
Processor socket LGA 1156 (Socket H)
Processor lithography 32 nm
Box
Processor threads 4
System bus rate 2.5 GT/s
Processor operating modes 64-bit
Processor boost frequency 3.46 GHz
Processor cache 4 MB
Processor cache type L3
Thermal Design Power (TDP) 73 W
Memory bandwidth supported by processor (max) 21 GB/s
Graphics
On-board graphics card
On-board graphics card model Intel® HD Graphics
On-board graphics card base frequency 733 MHz
Number of displays supported (on-board graphics) 2
Processor special features
Intel Trusted Execution Technology
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Turbo Boost Technology
Intel FDI Technology
Intel® Smart Cache
Intel® AES New Instructions (Intel® AES-NI)
Intel® Clear Video HD Technology (Intel® CVT HD)
Enhanced Intel SpeedStep Technology
Intel Demand Based Switching
Intel Virtualization Technology (VT-x)
Intel VT-x with Extended Page Tables (EPT)
Intel® vPro™ Platform Eligibility
Features
Thermal Monitoring Technologies
Idle States
Execute Disable Bit
Maximum number of PCI Express lanes 16
PCI Express slots version 2.0
PCI Express configurations 1x16, 2x8
Number of Processing Die Transistors 382 M
Processing Die size 81 mm²
Number of Graphics & IMC Die Transistors 177 M
Graphics & IMC Die Size 114 mm²
Supported instruction sets SSE4.2
Embedded options available
Graphics & IMC lithography 45 nm
Memory
Maximum internal memory supported by processor 16 GB
Memory types supported by processor DDR3-SDRAM
Memory clock speeds supported by processor 1066,1333 MHz
Memory channels Dual-channel
Other features
Intel® Virtualization Technology (Intel® VT) VT-x
Operational conditions
Tcase 72.6 °C