Manufacturer: HP
Model: 604614-001
EAN: 5711045476976
HP Intel Core i5-650. Processor family: Intel® Core™ i5, Processor socket: LGA 1156 (Socket H), Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card base frequency: 733 MHz. PCI Express configurations: 1x16, 2x8, Number of Processing Die Transistors: 382 M, Processing Die size: 81 mm². Intel® Virtualization Technology (Intel® VT): VT-x
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HP Intel Core i5-650 protsessor 3,2 GHz 4 MB L3 | €488.00 |
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Processor | |
Processor family | Intel® Core™ i5 |
Processor generation | Intel® Core™ i5 |
Processor model | i5-650 |
Processor base frequency | 3.2 GHz |
Processor cores | 2 |
Processor socket | LGA 1156 (Socket H) |
Processor lithography | 32 nm |
Box | |
Processor threads | 4 |
System bus rate | 2.5 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.46 GHz |
Processor cache | 4 MB |
Processor cache type | L3 |
Thermal Design Power (TDP) | 73 W |
Memory bandwidth supported by processor (max) | 21 GB/s |
Graphics | |
On-board graphics card | |
On-board graphics card model | Intel® HD Graphics |
On-board graphics card base frequency | 733 MHz |
Number of displays supported (on-board graphics) | 2 |
Processor special features | |
Intel Trusted Execution Technology | |
Intel® Hyper Threading Technology (Intel® HT Technology) | |
Intel® Turbo Boost Technology | |
Intel FDI Technology | |
Intel® Smart Cache | |
Intel® AES New Instructions (Intel® AES-NI) | |
Intel® Clear Video HD Technology (Intel® CVT HD) | |
Enhanced Intel SpeedStep Technology | |
Intel Demand Based Switching | |
Intel Virtualization Technology (VT-x) | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel® vPro™ Platform Eligibility | |
Features | |
Thermal Monitoring Technologies | |
Idle States | |
Execute Disable Bit | |
Maximum number of PCI Express lanes | 16 |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8 |
Number of Processing Die Transistors | 382 M |
Processing Die size | 81 mm² |
Number of Graphics & IMC Die Transistors | 177 M |
Graphics & IMC Die Size | 114 mm² |
Supported instruction sets | SSE4.2 |
Embedded options available | |
Graphics & IMC lithography | 45 nm |
Memory | |
Maximum internal memory supported by processor | 16 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1066,1333 MHz |
Memory channels | Dual-channel |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Operational conditions | |
Tcase | 72.6 °C |