Manufacturer: HP
Model: 536899-001
EAN: 5711045202711
HP Intel Xeon X5570. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 45 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm². Processor package size: 42.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
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HP Intel Xeon X5570 protsessor 2,93 GHz 8 MB L3 | €3377.09 |
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Processor | |
Processor family | Intel® Xeon® 5000 Sequence |
Processor model | X5570 |
Processor base frequency | 2.93 GHz |
Processor cores | 4 |
Processor socket | Socket B (LGA 1366) |
Processor lithography | 45 nm |
Component for | Server/workstation |
Processor threads | 8 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.333 GHz |
Processor cache | 8 MB |
Processor cache type | L3 |
Thermal Design Power (TDP) | 95 W |
VID Voltage Range | 0.750 - 1.350 V |
Bus type | QPI |
Number of QPI links | 2 |
Memory bandwidth supported by processor (max) | 32 GB/s |
Graphics | |
On-board graphics card | |
Processor special features | |
Intel Trusted Execution Technology | |
Intel® Hyper Threading Technology (Intel® HT Technology) | |
Intel® Turbo Boost Technology | |
Enhanced Intel SpeedStep Technology | |
Intel Virtualization Technology (VT-x) | |
Intel Demand Based Switching | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel Virtualization Technology for Directed I/O (VT-d) | |
Features | |
Execute Disable Bit | |
Idle States | |
Market segment | Server |
Number of Processing Die Transistors | 731 M |
Processing Die size | 263 mm² |
Embedded options available | |
CPU configuration (max) | 2 |
Memory | |
Maximum internal memory supported by processor | 144 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,1066,1333 MHz |
Memory channels | Triple-channel |
ECC | |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Operational conditions | |
Tcase | 75 °C |
Weight & dimensions | |
Processor package size | 42.5 mm |