HP Intel Xeon X5570 processor 2.93 GHz 8 MB L3

Manufacturer: HP

Model: 536899-001

EAN: 5711045202711

HP Intel Xeon X5570. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 45 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 144 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Number of Processing Die Transistors: 731 M, Processing Die size: 263 mm². Processor package size: 42.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x


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HP Intel Xeon X5570 protsessor 2,93 GHz 8 MB L3 €3377.09

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Product information

Processor
Processor family Intel® Xeon® 5000 Sequence
Processor model X5570
Processor base frequency 2.93 GHz
Processor cores 4
Processor socket Socket B (LGA 1366)
Processor lithography 45 nm
Component for Server/workstation
Processor threads 8
System bus rate 6.4 GT/s
Processor operating modes 64-bit
Processor boost frequency 3.333 GHz
Processor cache 8 MB
Processor cache type L3
Thermal Design Power (TDP) 95 W
VID Voltage Range 0.750 - 1.350 V
Bus type QPI
Number of QPI links 2
Memory bandwidth supported by processor (max) 32 GB/s
Graphics
On-board graphics card
Processor special features
Intel Trusted Execution Technology
Intel® Hyper Threading Technology (Intel® HT Technology)
Intel® Turbo Boost Technology
Enhanced Intel SpeedStep Technology
Intel Virtualization Technology (VT-x)
Intel Demand Based Switching
Intel VT-x with Extended Page Tables (EPT)
Intel Virtualization Technology for Directed I/O (VT-d)
Features
Execute Disable Bit
Idle States
Market segment Server
Number of Processing Die Transistors 731 M
Processing Die size 263 mm²
Embedded options available
CPU configuration (max) 2
Memory
Maximum internal memory supported by processor 144 GB
Memory types supported by processor DDR3-SDRAM
Memory clock speeds supported by processor 800,1066,1333 MHz
Memory channels Triple-channel
ECC
Other features
Intel® Virtualization Technology (Intel® VT) VT-d, VT-x
Operational conditions
Tcase 75 °C
Weight & dimensions
Processor package size 42.5 mm