Manufacturer: Intel
Model: BX806894309Y
EAN: 0675901957793
The Intel Xeon Silver 4309Y processor offers high-performance computing for servers and workstations. With a base frequency of 2.8 GHz and a maximum boost frequency of 3.6 GHz, it delivers fast and efficient processing power. The processor supports a maximum internal memory of 6144 GB and features octa-channel memory channels with DDR4-SDRAM memory types supported.
Built for the 3rd Generation Intel Xeon Scalable family, this processor delivers top-of-the-line performance with its 8 processor cores and 16 threads. It also boasts a 105W Thermal Design Power (TDP) and a 10nm processor lithography for energy-efficient computing.
Supported instruction sets include SSE4.2, AVX, AVX 2.0, and AVX-512, while its scalability of 2S allows for flexible deployment in a wide range of server environments. Its package type comes in a retail box for easy and secure storage, while its Maximum Enclave Size Support for Intel SGX is up to 8GB.
Overall, the Intel Xeon Silver 4309Y processor is an excellent choice for those in need of high-performance computing for their servers and workstations.
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Price history
Processor | |
Processor manufacturer | Intel |
Processor family | Intel Xeon Silver |
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor model | 4309Y |
Processor base frequency | 2.8 GHz |
Processor cores | 8 |
Processor socket | LGA 4189 |
Processor lithography | 10 nm |
Box | Yes |
Cooler included | No |
Component for | Server/workstation |
Processor threads | 16 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.6 GHz |
Performance-core base frequency | 2.8 GHz |
Processor cache | 12 MB |
Thermal Design Power (TDP) | 105 W |
Processor codename | Ice Lake |
Processor ARK ID | 215275 |
Graphics | |
On-board graphics card | No |
Discrete graphics card | No |
On-board graphics card model | Not available |
Discrete graphics card model | Not available |
Processor special features | |
Intel® Speed Shift Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Maximum Enclave Size Support for Intel® SGX | 8 GB |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel VT-x with Extended Page Tables (EPT) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel 64 | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Features | |
Execute Disable Bit | Yes |
Market segment | Server |
Maximum number of PCI Express lanes | 64 |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Embedded options available | No |
Scalability | 2S |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Packaging data | |
Package type | Retail box |
Operational conditions | |
Tcase | 76 °C |
Other features | |
Maximum internal memory | 6 TB |
Technical details | |
Supported memory types | DDR4-SDRAM |
Target market | Cloud Computing |
Status | Launched |
Launch date | Q2'21 |
Number of UPI links | 2 |
Memory speed (max) | 2667 MHz |
Servicing status | Baseline Servicing |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Logistics data | |
Harmonized System (HS) code | 85423119 |