Manufacturer: Intel
Model: BX806894310
EAN: 0675901957779
Upgrade your server or workstation with the powerful Intel Xeon Silver 4310 processor. This 3rd Generation Intel Xeon Scalable processor boasts 12 cores, 24 threads, and a base frequency of 2.1 GHz. With a maximum boost frequency of 3.3 GHz, you can turbocharge your applications for lightning-fast processing speeds.
The processor supports octa-channel memory and can handle up to 6144 GB of DDR4-SDRAM memory, making it perfect for memory-intensive tasks. It also supports advanced instruction sets like SSE4.2, AVX, AVX 2.0, and AVX-512, allowing for enhanced performance in various applications.
In addition to its impressive processing capabilities, the Intel Xeon Silver 4310 also boasts advanced security features like Intel AES New Instructions and Intel Software Guard Extensions. It also supports Intel’s Hyper-Threading and Turbo Boost technologies, which enhance performance by allowing more efficient use of the processor’s resources.
Built with a 10 nm lithography and FCLGA4189 socket, this processor is designed for use in servers and workstations. It has a thermal design power of 120 W and a package size of 77.5 x 56.5 mm.
Upgrade your server or workstation with the Intel Xeon Silver 4310 processor and experience lightning-fast processing speeds and enhanced security features.
Shop | Title | Price |
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Intel Xeon Silver 4310 protsessor 2,1 GHz 18 MB Karp | €883.89 |
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Processor special features | |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel 64 | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Platform Firmware Resilience Support | Yes |
Maximum Enclave Size Support for Intel® SGX | 8 GB |
Intel® Crypto Acceleration | Yes |
Intel® Total Memory Encryption | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Speed Shift Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Processor | |
Processor ARK ID | 215277 |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 120 W |
Processor cache | 18 MB |
Processor boost frequency | 3.3 GHz |
Processor operating modes | 64-bit |
System bus rate | 10.4 GT/s |
Processor threads | 24 |
Component for | Server/workstation |
Cooler included | No |
Box | Yes |
Processor lithography | 10 nm |
Processor socket | LGA 4189 |
Processor cores | 12 |
Processor base frequency | 2.1 GHz |
Processor model | 4310 |
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor family | Intel Xeon Silver |
Processor manufacturer | Intel |
Memory | |
ECC | Yes |
Memory channels | Octa-channel |
Memory clock speeds supported by processor | 2667 MHz |
Memory types supported by processor | DDR4-SDRAM |
Maximum internal memory supported by processor | 6.14 TB |
Features | |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Scalability | 2S |
Embedded options available | Yes |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
PCI Express slots version | 4.0 |
Maximum number of PCI Express lanes | 64 |
Market segment | Server |
Execute Disable Bit | Yes |
Graphics | |
Discrete graphics card model | Not available |
On-board graphics card model | Not available |
Discrete graphics card | No |
On-board graphics card | No |
Technical details | |
Servicing status | Baseline Servicing |
Memory speed (max) | 2667 MHz |
Number of UPI links | 2 |
Status | Launched |
Launch date | Q2'21 |
Target market | Cloud Computing |
Supported memory types | DDR4-SDRAM |
Operational conditions | |
Tcase | 82 °C |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Other features | |
Maximum internal memory | 6 TB |