Intel R1304WFTYS server barebone C624 LGA 3647 (Socket P) Rack (1U) Black, Silver

Manufacturer: Intel

Model: R1304WFTYS

EAN: 0735858344708

Intel R1304WFTYS. Motherboard chipset: C624, Processor socket: LGA 3647 (Socket P), Processor family: Intel® Xeon®. Supported memory types: DDR4-SDRAM, Supported RDIMM clock speeds: 2133,2400,2666 MHz. Storage drive sizes supported: 2.5,3.5", Supported storage drive types: HDD & SSD, Supported storage drive interfaces: Serial ATA III. Ethernet interface type: 10 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet, Ethernet LAN data rates: 10,100,1000,10000 Mbit/s. Market segment: Server


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Product information

Processor
Built-in processor
Motherboard chipset C624
Processor socket LGA 3647 (Socket P)
Processor family Intel® Xeon®
Number of processors supported 2
Compatible processor series Intel® Xeon®
Ports & interfaces
USB ports quantity 5
Ethernet LAN (RJ-45) ports 2
Serial ports quantity 2
Number of SATA connectors 10
Number of SATA III connectors 10
Power
Power supply type AC
Power supply 1100 W
Number of power supply units 1
Processor special features
Intel Advanced Management Technology
Intel Rapid Storage Technology enterprise
Intel Build Assurance Technology
Intelligent Platform Management Interface (IPMI) support
Intel Quiet Thermal Technology
Intel Remote Management Module Support
Intel Quiet System Technology (QST)
Intel Efficient Power Technology
Intel On-Demand Power Redundancy Technology
Intel Fast Memory Access
Intel Intelligent Power Node Manager
Intel Flex Memory Access
Intel Server Customization Technology
Intel Virtualization Technology for Directed I/O (VT-d)
Intel Server Management Software
Intel® Optane™ Memory Ready
Connector for Intel I/O Expansion Module 1
Connector for Intel I/O Expansion Module x8 Gen 3 1
Internal I/O Expansion Module x8 Gen 3 1
Design
Chassis type Rack (1U)
Product colour Black, Silver
Rack rails
Rack-Friendly board
Redundant fans support
Heat sink (2) 1U Standard Heat Sink FXXCA78X108HS
Heat sink included
Features
Integrated BMC with IPMI
Trusted Platform Module (TPM)
Trusted Platform Module (TPM) version 2.0
Market segment Server
ARK ID 89006
Backplanes Included
Intel Node Manager
Memory
Number of DIMM slots 24
Supported memory types DDR4-SDRAM
Supported RDIMM clock speeds 2133,2400,2666 MHz
Storage
Number of storage drives supported 6
Hot-swap HDD bays
Number of 3.5" bays 4
Storage drive sizes supported 2.5,3.5 "
Supported storage drive types HDD & SSD
Supported storage drive interfaces Serial ATA III
RAID levels 0, 1, 10
Embedded USB (eUSB) SSD option
Expansion slots
PCI Express x8 (Gen 3.x) slots 1
PCI Express x16 (Gen 3.x) slots 2
PCI Express x24 Riser Super slots 2
Network
Ethernet LAN
Ethernet interface type 10 Gigabit Ethernet, Fast Ethernet, Gigabit Ethernet
Ethernet LAN data rates 10,100,1000,10000 Mbit/s
Other features
CPU configuration (max) 2
Product type System
Expected discontinuance date Q3'19
Statement of conformance & platform certificate included
Target market Full-featured
Riser slot 1 number of lanes 24
Included riser slot 1 configuration(s) 1x PCIe Gen3 x16
Number of storage drives supported (internal) 2
Optical drive supported
Supported RAID configuration SW RAID 0, 1, 10, optional 5
Additional information URL http://cqpreview.intel.com/content/www/us/en/motherboards/server-motherboards/server-board-s2600wf.html?cache=no
Riser slot 2 number of lanes 24
3.5" HDD support Hot-swap 3.5" HDD or 2.5" SSD
Status Launched
Chassis dimensions 430 x 709.9 x 43.7 mm
Riser Slot 2 configuration 1x PCIe Gen3 x16
Supported board Intel Server Board S2600WFT
Launch date Q3'17
Extended warranty available for purchase (select countries)
Redundant fans
Supported storage drives form factor (internal) M.2 SSD
Last change 64827219
Product family 1U server system
Weight & dimensions
Width 430 mm
Height 43.7 mm
Depth 709.9 mm
Logistics data
Harmonized System (HS) code 8473301180
Packaging data
Packaging content (1) Intel Server Board S2600WFT (Dual 10GbE LAN) S2600WFT, (2) Riser card assembly with 1 slot PCIe x16 riser card F1UL16RISER3, (4) 3.5” Hot-swap drive bays with drive carriers and drive blanks: Includes (1) 12 Gb SAS backplane FR1304S3HSBP, (4) 3.5” hot swap drive tool less carriers FXX35HSCAR2, (1) Standard control panel assembly FXXFPANEL2, (1) Front I/O Panel assembly (VGA and 2 x USB), (1) 150mm Backplane I2C cable, (1) 850mm MiniSAS HD Cable AXXCBL850HDHRT, (1) 350mm Backplane power cable, (1) Air duct, (6) Dual rotor system fans FR1UFAN10PW, (8) DIMM slot blanks, (1) Chassis Stiffener Bar, (1) 1100W power supply module AXX1100PCRPS, (2) CPU heat sinks FXXCA78X108HS, (2) CPU heat sink “No CPU” Label inserts, (2) Standard CPU Carrier, (1) Power supply bay blank insert, (2) Chassis handle (1 set) installed A2UHANDLKIT3, (2) AC Power Cord retention strap assembly