Manufacturer: Lenovo
Model: 5458B2G
EAN: 4053162396210
Lenovo System x 3250 M5. Processor family: Intel® Xeon® E3 V3 Family, Processor frequency: 3.1 GHz, Processor model: E3-1220V3. Internal memory: 4 GB, Internal memory type: DDR3-SDRAM, Memory layout (slots x size): 1 x 4 GB. HDD size: 3.5", HDD interface: Serial ATA. Ethernet LAN, Cabling technology: 10/100/1000Base-T(X). Power supply: 300 W. Chassis type: Rack (1U)
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Processor | |
Processor manufacturer | Intel |
Processor family | Intel® Xeon® E3 V3 Family |
Processor model | E3-1220V3 |
Processor frequency | 3.1 GHz |
Processor boost frequency | 3.5 GHz |
Processor cores | 4 |
Processor cache | 8 MB |
Motherboard chipset | Intel® C226 |
Memory channels supported by processor | Dual |
Number of processors installed | 1 |
Thermal Design Power (TDP) | 80 W |
Processor cache type | Smart Cache |
System bus rate | 5 GT/s |
Thermal Monitoring Technologies | |
Scalability | 1S |
FSB Parity | |
Embedded options available | |
Bus type | DMI |
Idle States | |
Execute Disable Bit | |
Graphics & IMC lithography | 22 nm |
Processor series | Intel Xeon E3-1200 v3 |
Maximum internal memory supported by processor | 32 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1333,1600 MHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
ECC supported by processor | |
Maximum number of PCI Express lanes | 16 |
Processor codename | Haswell |
Number of QPI links | 1 |
PCI Express configurations | 1x8, 1x16, 2x4, 2x8 |
Thermal solution specification | PCG 2013D |
Processor package size | 37.5 x 37.5 mm |
Stepping | C0 |
Processor socket | LGA 1150 (Socket H3) |
Processor lithography | 22 nm |
Maximum number of SMP processors | 1 |
Supported instruction sets | AVX 2.0, SSE4.1, SSE4.2 |
Processor operating modes | 64-bit |
Processor threads | 4 |
Conflict-Free processor | |
Design | |
Chassis type | Rack (1U) |
Power | |
Redundant power supply (RPS) support | |
Power supply | 300 W |
Number of main power supplies | 1 |
Memory | |
Internal memory | 4 GB |
Internal memory type | DDR3-SDRAM |
Memory layout (slots x size) | 1 x 4 GB |
Memory clock speed | 1600 MHz |
ECC | |
Memory slots | 4 |
Maximum internal memory | 32 GB |
Storage | |
Maximum storage capacity | 12 TB |
HDD interface | Serial ATA |
HDD size | 3.5 " |
Number of HDDs supported | 4 |
RAID support | |
Hot-swap | |
Optical drive type | |
Ports & interfaces | |
Ethernet LAN (RJ-45) ports | 4 |
USB 2.0 ports quantity | 6 |
Serial ports quantity | 1 |
VGA (D-Sub) ports quantity | 1 |
Graphics | |
On-board graphics card | |
On-board graphics card model | Not available |
Maximum graphics card memory | 16 MB |
Software | |
Operating system installed | |
Compatible operating systems | Microsoft Windows Server 2012 R2/ Microsoft Windows Server 2012/Microsoft Windows Server 2008 R2, Red Hat Linux, Novell SUSE Linux, VMware |
Expansion slots | |
PCI Express x8 (Gen 3.x) slots | 2 |
PCI Express slots version | 3.0 |
Operational conditions | |
Operating temperature (T-T) | 10 - 35 °C |
Storage temperature (T-T) | -40 - 60 °C |
Storage relative humidity (H-H) | 8 - 80 % |
Operating altitude | 0 - 914 m |
Weight & dimensions | |
Width | 435 mm |
Height | 43 mm |
Depth | 576 mm |
Processor special features | |
Intel Trusted Execution Technology | |
CPU configuration (max) | 1 |
Intel Enhanced Halt State | |
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) | |
Intel VT-x with Extended Page Tables (EPT) | |
Intel Demand Based Switching | |
Intel® Turbo Boost Technology | 2.0 |
Intel® Quick Sync Video Technology | |
Intel® InTru™ 3D Technology | |
Intel® Wireless Display (Intel® WiDi) | |
Intel FDI Technology | |
Intel® Clear Video HD Technology (Intel® CVT HD) | |
Intel Dual Display Capable Technology | |
Intel® Insider™ | |
Intel Fast Memory Access | |
Intel Flex Memory Access | |
Intel® AES New Instructions (Intel® AES-NI) | |
Enhanced Intel SpeedStep Technology | |
Intel Rapid Storage Technology | |
Intel Clear Video Technology | |
Intel Identity Protection Technology version | 1.00 |
Intel Virtualization Technology (VT-x) | |
Intel Stable Image Platform Program (SIPP) version | 1.00 |
Intel TSX-NI version | 1.00 |
Processor ARK ID | 75052 |
Intel TSX-NI | |
Intel® Secure Key | |
Intel 64 | |
Intel Stable Image Platform Program (SIPP) | |
Intel® OS Guard | |
Intel Virtualization Technology for Directed I/O (VT-d) | |
Intel® Hyper Threading Technology (Intel® HT Technology) | |
Intel Secure Key Technology version | 1.00 |
Intel® Identity Protection Technology (Intel® IPT) | |
Intel® My WiFi Technology (Intel® MWT) | |
Intel® Anti-Theft Technology (Intel® AT) | |
Network | |
LAN controller | Broadcom BCM5719 |
Ethernet LAN | |
Ethernet interface type | Gigabit Ethernet |
Cabling technology | 10/100/1000Base-T(X) |
Other features | |
Graphics card | G200eR2 |