DeepCool EX750 heat sink compound Thermal paste 6.2 W/m·K 3 g
Manufacturer: DeepCool
Model: R-EX750-GY030C-G-1
EAN: 6933412700111
The DeepCool EX750 thermal paste is a high-quality heat sink compound designed to maximize heat dissipation and promote efficient cooling of your computer's CPU. With a thermal conductivity of 6.2 W/m·K, this thermal paste ensures fast, effective heat transfer between the CPU and the heat sink. Thanks to its low thermal resistance of 0.03°C/W, the DeepCool EX750 paste promotes superior thermal performance and reduces the risk of overheating. Its operating temperature range of -50 to 250°C makes it a versatile option for use in a broad range of computer systems. The grey-colored paste has a specific gravity of 2.6 g/cm³, ensuring it stays in place once applied. Each package includes two blister packs, with each pack containing 3g of the thermal paste. The DeepCool EX750 thermal paste has a package type of blister and is an essential component for anyone looking to optimize their computer's cooling system.
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Product information
| Features | |
| Type | Thermal paste |
| Thermal conductivity | 6.2 W/m·K |
| Product colour | Grey |
| Thermal resistance | 0.03 °C/W |
| Specific gravity | 2.6 g/cm³ |
| Operating temperature (T-T) | -50 - 250 °C |
| Packaging data | |
| Quantity per pack | 2 pc(s) |
| Package type | Blister |
| Weight & dimensions | |
| Weight | 3 g |